The goal of the partnership is to enable the exchange of intellectual property (IP), increase the accuracy of radio frequency (RF) and microwave design processes for network equipment and mobile devices.
Components such as inductors, capacitors, connectors, and encapsulated filters used in wireless communication devices are encapsulated in very small, compressed packages to achieve greater functionality and product miniaturization. The resulting component-to-component electromagnetic field interactions and coupling, which are typically ignored in a system-level modeling approach, can influence circuit performance, especially at millimeter-wave and higher 5G frequencies. The ability to predict these effects during simulation is critical for meeting development deadlines within budget.
Modelithics and ANSYS will create a library of models defined by their physical geometry and material properties, capable of accurately simulating interactions between components and their surrounding environment. These simulation-ready 3D components can be easily added to larger system designs in ANSYS® HFSS™ without the need to apply excitations, boundary conditions, or material properties.
“Through this partnership, discrete component developers can create simulation-ready 3D components in ANSYS HFSS and provide them to end users for referencing in larger simulation systems,” said Larry Dunleavey, president of Modelithics. “The ability to collaborate across 3D components allows vendors to offer their customers simulation-ready HFSS models, giving them a valuable advantage in enabling design success from the outset.”
“Exchanging simulation-ready 3D components is a new paradigm in electronics design and is made possible by the use of high-level, proprietary ANSYS standard encryption algorithms to hide model details in the HFSS,” says Mark Ravenstahl, Technical Director, Strategic Partnerships and Business Development at ANSYS. “As a leader in providing RF and microwave models, Modelithics is the right partner for this project.”
