“Strengthening our ongoing alliance with Open Innovation Platform® (OIP) ecosystem partners like Siemens keeps us at the forefront of accelerating advancements in 3D integrated circuit design for AI innovation,” said Dan Kochpatcharin, Head of Ecosystem Management and Alliances at TSMC. “Our long-standing collaboration with Siemens enables our mutual customers to fully leverage the power, performance, and efficiency of TSMC’s cutting-edge technologies.”
N2/N3 Certifications:
Siemens’ Calibre® nmPlatform tool is now certified to TSMC’s N2 and N2P processes. The N2 certification includes the new LSVRF (Local Standard Verification Rule Format) functionality in Calibre, which enables independent rule checking within specific processor regions for optimal verification accuracy. The collaboration around Siemens’ Calibre portfolio also includes TSMC’s N2 qualification for Siemens’ Calibre xACT™ software.
Siemens and TSMC have collaborated to certify parts of Siemens' Solido™ Simulation Suite software for analog, mixed-signal, RF, and memory designs, with the recent certification of Siemens' Solido SPICE and Analog FastSPICE (AFS) tools for TSMC's N2 and N2P processes. Furthermore, as part of the Custom Design Reference Flow (CDRF) for TSMC's N2 process, Siemens' AFS tool now supports TSMC's Reliability Aware Simulation technology, which addresses IC aging and self-heating effects in real time, among other advanced reliability features. The CDRF for TSMC's N2 technology also integrates Siemens' Solido™ Design Environment software for advanced variation-aware verification.
To support and advance next-generation physical implementation designs, TSMC has qualified Siemens' Aprisa™ place-and-route software for the foundry's N3E and N3P processes to deliver new levels of performance and energy efficiency to Aprisa customers.
Further
expanding collaboration in silicon photonics, Siemens and TSMC are working to develop a flow methodology to help customers leverage the foundry's Compact Universal Photonic Engines (COUPE) silicon photonics technology using Siemens tools. Ongoing collaborations include Tanner™ software's custom IC tools for photonic IC design, Xpedition™ Substrate Integrator software for system assembly, and Siemens' Calibre® 3DStack software for physical verification of the entire integrated COUPE system.
Siemens and TSMC have also collaborated on the definition and testing of Calibre 3DThermal software, Siemens' latest thermal analysis solution for verifying and debugging advanced 3D integrated circuits (3D-ICs).
Siemens' relationship with TSMC now extends to services as well, with Siemens officially joining the TSMC Design Center Alliance (DCA). As a member of this alliance, Siemens offers a comprehensive portfolio of services with a proven track record of facilitating design for TSMC customers, ranging from startups to Fortune 500 companies. Siemens' services cover crucial elements of the integrated circuit design workflow, including placement and routing support, design for testing, functional verification, emulation, custom memory development, and integrated circuit packaging. Customers worldwide have partnered with Siemens' services organization to deliver products for a wide range of applications, including artificial intelligence, high-performance computing (HPC), and other rapidly growing markets.
Furthermore, as part of TSMC's cloud-based Secure Chamber initiative, Siemens and TSMC have successfully demonstrated the Calibre, mPower, and AFS toolsets running on the AWS cloud. Targeting toolsets qualified for TSMC's N3/N2 cloud certification, this initiative demonstrates the tool's accuracy while running in cloud-based environments, as well as the ability to use cloud-based virtual secure cameras to optimize performance and troubleshoot issues, all with the aim of speeding up recording time and improving the quality of the results.
