By providing FAPS with the Yamaha S20 modular 3D dispensing and assembly machine, Yamaha has enabled the faculty to use the Yamaha S20 with its unique robotic manipulator to build 3D MID products by dispensing glue and/or solder paste and assembling the electronic components in a single production step. Yamaha is also providing technical support and expertise, leveraging the skills of its experienced field engineers, to help maintain the machine and contribute to learning and research.
The collaboration with FAPS builds on Yamaha's membership in the German 3D MID eV Research Association, announced in April 2020, further reinforcing the company's commitment to 3D MID technology. By enabling circuit structuring and component placement directly onto a molded substrate, such as a device housing, 3D MID allows complex, high-tech products to be produced simply and cost-effectively, while also being small and lightweight. It is an ideal technology for advanced consumer devices, automotive electronics, and IoT endpoints such as smart sensors and actuators.
"Yamaha's commitment enhances the quality of education we can offer our students and equips our researchers to tackle exciting new challenges. We can do so much more now that we have a fully automated 3D MID line, and the technical support from the Yamaha team gives us extra confidence to go further and unlock the full potential of this technology," says FAPS Institute Director, Prof. Dr.-Ing. Jörg Franke.
Richard Vereijssen, Product Marketing Manager for the Robotics business at Yamaha Motor Europe, commented: "FAPS' 3D MID program is closely aligned with our vision for the future, and we are delighted to help tomorrow's engineers gain the knowledge they need through hands-on experience." He added, "It's a learning opportunity for us as well, as we continue to develop future generations of equipment and services to support our commercial customers.".
The Yamaha S20 modular hybrid assembler, as supplied to FAPS, is currently the leading standard for 3D MID production. The machine combines a 3D manipulator robot with multiple dispensing heads and surface mount pick-and-place heads to consolidate solder paste and/or adhesive dispensing with component placement on the same platform. In addition to saving space and speeding up 3D MID assembly, the S20 also features easy programming to simplify and accelerate prototyping and mass production
