LFPAK33 devices also exhibit significantly lower resistance, responding to increasing industry pressure to reduce module size in automobiles, while continuing to improve energy efficiency and reliability. LFPAK33 MOSFETs enable the power infrastructure that allows next-generation automotive subsystems such as radar and ADAS technology to operate reliably and efficiently.
The Nexperia LFPAK33 package utilizes a copper clip design to reduce package resistance and inductance, which in turn lowers the RDS(on) and MOSFET losses. The resulting package has an ultra-compact footprint of 10.9 mm²,and because no wires or tails are used internally, operating temperatures up to 175°C Tj max are possible. The devices can handle up to 70 A, and the broad product portfolio includes devices ranging from 30 V to 100 V and with an RDS(on) as low as 6.3 mΩ.
Target applications include: connected modules for automotive, next-generation engine management systems; chassis and safety technology; LED lighting; relay replacements; C2X, radar, info and navigation systems; ADAS.
