This new package has an ultra-low series resistance (265 microhm), more than 2.5 times lower than existing SOIC16W solutions, while offering Allegro's highest certified insulation rating of 5kV.
The first devices available in this new package are the Allegro ACS724 and ACS725 current sensor ICs, both offering leading performance in terms of speed and accuracy. These devices are ideal for applications such as DC/DC converters, solar inverters, UPS systems, on-board EV chargers (OBC), EV charging stacks, and motor control.
The package provides higher power density in a smaller footprint.
With a trend toward smaller solution sizes, engineers face more thermal challenges. The new MC package has a copper frame more than twice (2X) thicker than that of standard SOIC semiconductor packages. This enables the ultra-low resistance of the 265 microhm series, which improves current density in the Allegro package and, therefore, power density in customer applications. At the same time, the SOIC16W footprint also allows for smaller PCBs. The package is capable of handling >80 A of continuous current, depending on the operating temperature requirements, and subsequently reduces the need for external cooling components.
“We all need to work towards a more sustainable future, and Allegro’s innovations are at the forefront. Electric and hybrid vehicle designers are working to reduce the weight and size of their systems,” explains Shaun Milano, Business Unit Director for Current Sensors at Allegro. “They need to offer higher power density solutions, and the new MC package now makes this easier than ever.”.
Allegro's patented, optimized manufacturing improves insulation rating.
Patented internal package constructions offer another Allegro first with a 5kV insulation rating, enabling customers to operate at continuous voltages up to 1600VDC and 1140VRMS. This meets the needs of the most demanding electric vehicle applications and the new 1500VDC solar standards.
