With SiC Schottky barrier diodes (SBDs) and silicon IGBTs, the panels achieve high efficiency, reduced size, and lighter inverters. The modules are designed for typical switching frequencies above 20 kHz.
The new hybrid SiC power modules are encapsulated in 2-in-1 configurations of 1200V and currents of 100A (CMH100DY-24NFH), 150A (CMH150DY-24NFH), 200A (CMH200DU-24NFH), 300A (CMH300DU-24NFH), 400A (CMH400DU-24NFH), or 600A (CMH600DU-24NFH). All modules are compatible with conventional Mitsubishi Electric pure silicon-based power modules. The 100A and 150A modules, which are integrated into a package with a footprint of 48 mm x 94 mm, offer reduced internal inductance, which is approximately 30% lower than in conventional modules. The 200A and 300A modules measure 62mm x 108mm, while the 400A and 600A modules require only 80mm x 110mm of motherboard space. Typical applications include uninterruptible power supplies (UPS) and power supplies for medical devices.
About Mitsubishi Electric:
With over 90 years of experience supplying reliable, high-quality products to both corporate and consumer customers worldwide, Mitsubishi Electric Corporation is a recognized global leader in the manufacture, marketing, and sale of electrical and electronic equipment used in information and communications processing, space and satellite communications development, consumer electronics, industrial technology, energy, transportation equipment, and construction.
With approximately 121,000 employees, the company recorded consolidated group sales of €29.5 million* for the fiscal year ended March 31, 2013.
