These technologies are driving the adoption of energy regeneration applications in industrial equipment, automotive START/STOP systems, and voltage sag countermeasures (instantaneous voltage drop).
The BD14000EFV-C integrates more than 20 discrete components required for EDLC cell leveling onto a single chip, reducing the mounting area by 38% compared to conventional solutions, while also eliminating component variations. This makes it easy to configure compact, highly reliable EDLC systems.
In addition to cell leveling functionality for up to 6 cells, multiple ICs can be connected 
in series to allow simultaneous control of even more cells. The cell leveling voltage can be adjusted between 2.4V and 3.1V, ensuring support for various types of EDLCs. A flag output is also integrated, along with an overcurrent detection voltage function with adjustable detection voltage settings based on the cell leveling voltage. Furthermore, the AEC-Q100 rating ensures trouble-free use in automotive and other environments that demand high reliability.
Compared to other storage devices, EDLC offers 
faster charge/discharge performance, longer lifespan, and greater safety, while minimizing environmental impact, making it ideal for various applications—including industrial and automotive systems. And every year, higher voltages and greater capacitances are required for use in high-power environments.
When multiple EDLCs are connected in series to withstand higher voltages, the voltage applied to each EDLC cell can vary, which can negatively impact their lifespan and reduce the amount of time they can be safely used. Until now, cell leveling has been achieved through discrete configurations, so several issues, such as board space and load design, need to be addressed to minimize fluctuations while maintaining reliable cell leveling operation.
In response, ROHM, in cooperation with Nippon Chemi-Con Corp., an industry leader in the development of EDLCs and aluminum electrolytic capacitors, has developed a compact, easy-to-mount EDLC cell leveling IC that provides high-performance operation and integrates multiple protection functions.
