Compared to devices incorporating solder contact technology, the VS-40MT160P-P, VS-70MT160P-P, and VS-100MT160P-P dramatically reduce production costs and increase the reliability of soldering machines, UPSs, switched-mode power supplies, and motors.
The solderless PressFit technology of these power modules enables easy, one-step board mounting, significantly reducing PCB assembly time while simplifying field maintenance. Offering direct heatsink mounting, the low-profile 17 mm devices maximize space savings while optimizing electrical designs for application-specific power supplies.
Providing greater long-term reliability and durability compared to solder contact technology, the PressFit encapsulation of these power modules offers increased resistance to shock and vibration, eliminating issues such as cold spots, voids, spatter, and cracks. Furthermore, the devices are not subject to solder fatigue, a common failure mechanism in power modules operating at high temperatures.
Optimized for AC/DC input rectification, the 45 A VS-40MT160P-P, 75 A VS-70MT160P-P, and 100 A VS-100MT160P-P offer 3500 VRMS of insulation voltage, low forward voltage, and low thermal resistance. Designed and rated for industrial-grade applications, the RoHS-compliant devices are UL approved, file E78996.
- Details
- Category: Integrated Circuits
Vishay Three-Phase Bridge Power Module
Vishay Intertechnology, Inc. introduces a new series of low-profile 45A to 100A three-phase bridge power modules in MTP PressFit packaging.
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