However, when the current thinnest package isn't good enough for some of our discerning customers, we go the extra mile to break that "it's not possible" barrier by introducing the new, even thinner DFN Optocoupler package. This new ultra-thin package is 25% thinner than the 2mm high Mini-Flat package, or up to 60% thinner compared to the most common 4-pin DIP package on the market. This significant reduction in thickness is made possible by our proudly patented Double Molded Co-planar Technology (DMC™), which helps achieve an isolation voltage of 2.5 kVrms/min while still ensuring an internal physical isolation distance of ≥0.4 mm. Regarding optical performance, the new CTP17 phototransistor device comes with a CTR performance guarantee and a low-current driving input of 1 mA. These are some of the key advantages of the CTP17 device to consider:
- A guaranteed CTR of 100%-300% under IF = 1mA / Vce = 5V test conditions for low-current design flexibility and overall system performance and efficiency. More CTR options will be available soon.
- Patented dual-mold coplanar design (DMCTM) that delivers best-in-class high-voltage insulation performance and overall package robustness for an ultra-thin type. - 2.5kVrms/min high-voltage insulation with ≥0.4mm internal physical insulation
- High operating temperature (110°C and 125°C version) to improve overall high-temperature reliability - Can be easily expanded to a dual and quad channel device with a unique DFN package design to serve a high-density system.
- 100% Pb-free and RoHS compliant with optional halogen-free selection to meet all green environmental initiatives. Availability: Contact your nearest CT Micro Sales.
