They can be used in smart consumer devices, such as connected smart homes and smart accessories, as well as in commercial and industrial applications, including access control, smart energy solutions, building automation, security cameras, infrastructure management, and medical devices.
“Thanks to Murata’s patented high-density packaging technology, the HaLow™ Type 2HK/2HL Wi-Fi modules offer both high- and low-power capabilities in a compact, surface-mount package,” said Masatomo Hashimoto, Director of Murata’s Communications and Sensors Business Unit. “By utilizing long-range, high-speed communication for private networks, manufacturers of smart devices and equipment can upgrade existing Wi-Fi/IP communication solutions for area expansion, thereby reducing radio frequency usage and improving energy efficiency, contributing to more sustainable solutions.”
Because they comply with native IP standards and incur no network costs, Type 2HK/2HL modules reduce the need for repeaters in existing Wi-Fi/IP-based communication solutions, enabling the expansion of the private network area and lowering system costs. Furthermore, compared to other low-power wide-area (LPWA) networking technologies, the long-range, high-speed communication of these modules facilitates the transmission of images and videos. This enhanced communication capability can be used in IoT deployments to inspect and maintain infrastructure and hazardous areas outside of cellular coverage, thus enabling automation with significant energy and cost savings.
Based on the NEWRACOM, Inc. NRC7394 chipset with an ARM® Cortex-M3 processor, the Type 2HK/2HL modules offer sufficient processing power to manage the Wi-Fi subsystem and user applications. The Type 2HK module operates at frequencies from 902 MHz to 928 MHz, while the Type 2HL covers 750 MHz to 950 MHz. Both modules feature an SPI interface for host and peripherals, including SPI, two UARTs, two I2C ports, a 2-channel, 10-bit ADC, and GPIO pins.
Sok Kyu Lee, CEO and President of NEWRACOM, explains: “The NRC7394 chipset represents the future of Wi-Fi for IoT applications, with low power consumption and extended range capabilities. By integrating our technology into Murata’s new module, we are providing a powerful platform for various industries to implement reliable and efficient wireless communications. We look forward to seeing this module accelerate the adoption of next-generation IoT solutions worldwide.”
Housed in a surface-mount LGA package with solder points, the modules measure 19 mm by 13.9 mm, have a maximum profile of 2.5 mm, and operate in a temperature range of -40 °C to +85 °C.
