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April 12, 2022

VINATech Co. has announced that its VPC (Vina Pulse Capacitor) hybrid capacitors will be used in the new 2022 eco-friendly solar cell TV remote control for Samsung Electronics' new Neo QLED TV. This marks the world's first time a hybrid capacitor has completely replaced the battery as the primary power source in a TV remote control.

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April 6, 2022

Farnell distributes this innovative hybrid protection component, hailed as a significant advancement in MOV device design and winner of Electronic Products' Passive Product of the Year Award in February 2022.

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March 31, 2022

KIOXIA Europe GmbH has announced that it has begun offering samples of its new automotive embedded flash memory (UFS) Ver. 3.1 devices. The new line utilizes the company's proprietary 3D BiCS FLASH memory and is available in capacities from 64 gigabytes (GB) to 512 GB, making it compatible with the diverse and ever-evolving requirements of automotive applications that enhance the driver experience.

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March 29, 2022

Harwin has introduced horizontal back covers for its Gecko-Screw-Lok (Gecko-SL) series of lightweight, high-reliability (Hi-Rel) connectors. These back covers ensure a fully shielded EMI/RFI connection for horizontal board-to-cable connections with a 1.25mm pitch. Previously, Gecko EMI/RFI shielding was only available for vertical board-to-cable orientations.

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March 23, 2022

Small autonomous and embedded systems, such as garage door openers, electric drills, manufacturing line equipment, and medical analysis systems, typically incorporate an 8-bit or 16-bit microcontroller surrounded by a series of analog integrated circuits and sensors, interface integrated circuits for visualization and communication, and sometimes SRAM, EEPROM, and NOR Flash that are not included in the selected microcontroller (see Figure 1).

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March 10, 2022

CUI Devices' Interconnect division today announced the addition of circular connectors to its connector product portfolio. Available in M12 connector types, the CUI Devices CDM12 family offers a range of male and female versions with 3, 4, 5, 8, and 12-pin contact position options.

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March 1, 2022

In-memory computing is destined to eliminate the huge data communication bottlenecks that often characterize AI-powered speech processing at the network edge, but it requires an embedded solution memory that simultaneously handles neural network computing and weight storage.

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February 25, 2022

KIOXIA Europe GmbH has announced the start of sample shipments ^[1] of the first ^[2] MIPI M-PHY® v5.0 ^[4 ] compliant Universal Flash Storage (UFS) embedded Flash memory devices ^[3] . The new range utilizes the company's latest generation BiCS FLASH™ 3D memory and is available in three capacities: 128 GB, 256 GB, and 512 GB.

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February 17, 2022

Mouser distributes Bourns' SRP8540A and SRP7020TA shielded automotive power inductors. These high-current power inductors are designed to meet the high current density and high-temperature requirements of various electronic applications.

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February 16, 2022

Vishay, distributed by RC Microelectrónica, SL, expands the range of resistance values ​​in case sizes 0402, 0603, 0805 and 1206 in its precision thin-film SMD resistors, approved for automotive applications.

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January 26, 2022

It has become the flagship "super-low ESR" series: Panasonic Industry's SP-Cap aluminum polymer capacitor portfolio is advisable when low ESR is the primary consideration in identifying the most suitable capacitor.

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January 19, 2022

KIOXIA Europe GmbH has announced the launch of its Universal Flash Storage (UFS) embedded memory devices, version 3.1^[1], which utilize innovative 4-bit-per-cell Quad-Level-Cell (QLC) technology. KIOXIA's QLC technology achieves the highest available density in a single package for high-density applications such as cutting-edge smartphones.