ASFETs are a new class of MOSFETs optimized for use in specific design scenarios. By focusing on application-critical parameters, sometimes at the expense of other, less important parameters in the same design, new levels of performance can be achieved. The new hot-swappable ASFETs utilize a combination of Nexperia's latest silicon technology and copper-clip package construction to significantly increase the safe operating area (SOA) and minimize the PCB footprint.
Previously, MOSFETs suffered from the Spirito effect, whereby SOA performance drops rapidly due to thermal instability at higher voltages. Nexperia's robust enhanced SOA technology eliminates the Spirito effect, increasing SOA by 166% at 50V compared to previous generations in D2PAK.
Another important advancement is the inclusion of the 125°C SOA specification in the datasheet. According to Mike Becker, International Director of Product Marketing at Nexperia: “Traditionally, SOA is only specified at 25°C, which means designers have to reduce power for operation in hot environments. Our new hot-exchange ASFETs include a 125°C SOA specification, eliminating this time-consuming task and confirming Nexperia’s excellent performance even at elevated temperatures.”
The new PSMN4R2-80YSE (80 V, 4.2 mΩ) and PSMN4R8-100YSE (100 V, 4.8 mΩ) hot-swappable ASFETs are packaged in the Power-SO8 compliant LFPAK56E. The package's unique internal copper clamp construction improves thermal and electrical performance while substantially reducing the footprint. The new LFPAK56E products measure only 5 mm x 6 mm x 1.1 mm, representing an 80% and 75% reduction in PCB footprint and device height, respectively, compared to previous-generation D2PAKs. The devices also feature a maximum junction temperature of 175 °C, meeting IPC9592 standards for industrial and telecommunications applications.
Becker adds: "Another advantage is improved current sharing in high-power applications that require multiple hot-swap MOSFETs in parallel, which enhances reliability and reduces system cost." Nexperia is widely recognized as the market leader in hot-swap MOSFETs. With these latest ASFETs, we've raised the bar once again."
The new hot-exchange ASFETs are the latest devices manufactured at Nexperia's new 8-inch wafer production facility in Manchester, UK, with capacity ready for volume orders.
More information, including product specifications and data sheets
You can also see this new technology in action at Nexperia's Power Live event from September 21-23
