This new component offers higher power density, allowing for a reduction in size and space savings on the PCB, improving efficiency and delivering higher current.
With very low conduction resistances,
it is ideal for designing power supplies, POLs, or DC/DC converters in applications such as telecom, radio frequency, or PCs/servers.
Features
: • TrenchFET® Gen IV power MOSFET.
• SkyFET® low-side MOSFET with integrated Schottky resistor.
• 100% Rg and UIS tested.
• Half-bridge configuration in a 3.3 mm x 3.3 mm footprint.
• Material categorization: For compliance definitions, please visit www.vishay.com/doc?99912
Applications
• CPU Power Supply
• PC/Server Peripherals
• POL/BUCK Converter
• DC/DC Telecommunications
