The new DP3 modules are designed to meet the growing demand for compact, cost-effective, and simple power converter solutions.
These modules utilize the latest IGBT7 technology, are designed to reduce power losses by up to 15–20% compared to IGBT4 devices, and operate reliably at higher temperatures up to 175°C under overload conditions. DP3 modules improve protection and control during high-voltage switching, making them ideal for maximizing power density, reliability, and ease of use in industrial drives, renewable energy, traction, energy storage, and agricultural vehicles.
Supplied in a phase-branch configuration, the DP3 power modules measure just 152 mm × 62 mm × 20 mm, freeing up valuable floor space and enabling increased power output. This advanced power package eliminates the need to connect multiple modules in parallel, helping to reduce system complexity and bill of materials costs. The DP3 modules also offer an alternative to conventional EconoDUAL™ packages to increase supply chain flexibility and security for customers.
DualPack 3 power modules are well-suited for general drive applications and address common problems such as dv/dt, control complexity, high conduction losses, and overload inability.
Microchip offers a comprehensive portfolio of power management solutions, including analog devices, silicon (Si) and silicon carbide (SiC) power technologies, dsPIC® Digital Signal Controllers (DSCs), and standard, modified, and custom power modules. For more information on Microchip's power management products, please visit the website.
Pricing and Availability:
DualPack 3 power modules are now available in production quantities. You can purchase them directly from Microchip or contact an authorized Microchip sales representative or distributor.
