The DOT-247 features a combined structure consisting of two TO-247 packages. This design allows the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance thanks to a unique internal structure. Furthermore, thanks to the optimized package structure, thermal resistance has been reduced by approximately 15% and inductance by approximately 50% compared to the TO-247. This enables a power density 2.3 times higher than that of the TO-247 in a half-bridge configuration, achieving the same power conversion circuitry in approximately half the volume.
The new products incorporating the DOT-247 package are available in two topologies: half-bridge and common source. Currently, two-level inverters are the dominant trend in photovoltaic inverters, but there is a growing demand for multi-level circuits, such as three-level NPC, three-level T-NPC, and five-level ANPC, to meet higher voltage requirements. The switching sections of these circuits combine topologies such as half-bridge and common source, which in many cases necessitates custom products when using conventional SiC modules.
To meet this challenge, ROHM has developed each of these two topologies – the smallest building blocks of multilevel circuits – into a 2-in-1 module. This allows for flexibility to support various configurations such as NPC circuits and DC-DC converters, while significantly reducing the number of components and the mounting area, and achieving circuit miniaturization compared to discrete components.
Evaluation cards will also be made available progressively to facilitate assessment during application design. For more information, please contact a sales representative or visit the contact page on the ROHM website.
Product range
Application examples:
Photovoltaic inverters, semiconductor relays, UPS (uninterruptible power supply systems), ePTO and boost converters for VPC (fuel cell vehicles).
AI servers (eFuse), electric vehicle charging stations, etc.
Sales Information
Availability: ROHM will begin mass production (in September 2025).
Samples of products meeting the AEC-Q101 automotive reliability standard are scheduled to begin shipping in October 2025.
comprehensive support
includes application-level assistance, including the in-house use of motor testing equipment. A variety of support materials are also available, such as simulations and thermal designs, enabling rapid evaluation and adoption of DOT-247 products. A dual-impulse testing evaluation kit is already available, allowing for immediate testing, while a three-phase inverter evaluation kit is currently in development, with reference designs scheduled for release starting in November 2025.
• About DOT-247 Design Models
SPICE Models: Available on the product web pages for each part number
LTspice® Models: The three-level NPC is scheduled to be available starting in October 2025 on the web pages
LTspice® is a registered trademark of Analog Devices, Inc.
When using third-party trademarks, adhere to the usage guidelines specified by the rights holder.
For more information, please contact a sales representative or visit the contact page on the ROHM website
EcoSiC
™ is a brand of devices that utilize silicon carbide (SiC) and is attracting attention in the power device field by demonstrating performance even superior to that of silicon (Si). ROHM independently develops technologies essential to the evolution of SiC, from wafer fabrication and production processes to packaging and quality control methods. At the same time, we have implemented an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.
EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.
