The new dual-chip solution features an isolation device with a high-bandwidth LLC controller, a synchronous rectification controller, and a FluxLink™ isolated control link, along with a separate half-bridge power device utilizing Power Integrations' proprietary 600V FREDFETs with lossless current sensing and Hs (High Side) and Ls (Low Side) controllers. Both devices are housed in low-profile InSOP™-24 packages. This highly integrated, low-power architecture eliminates heatsinks and reduces the number of components by up to 40% compared to discrete designs.
Edward Ong, senior director of product marketing at Power Integrations, states, "Resonant converters using separate drivers and discrete MOSFETs can be incredibly bulky and are notoriously difficult to manufacture due to their complexity and high component count. We've applied our advanced FREDFETs and FluxLink magneto-inductive technology to the LLC topology, achieving 98% efficiency and reducing the component count by 40%, while also eliminating bulky heatsinks and unreliable optocouplers. This allows designers to create compact adapters and open-chassis power supplies for TVs, monitors with USB PD ports, all-in-one computers, game consoles, and battery chargers for power tools and e-bikes."
Resonant converters are typically used when an application demands a level of efficiency unattainable with single-switch topologies, such as flyback converters. The HiperLCS-2 chipset leverages Power Integrations' high-speed FluxLink feedback mechanism to avoid the compromises typically associated with LLC topology, enabling designers to quickly and consistently implement high-performance, wide-range, low-component designs.
Power supply designs based on the new HiperLCS-2 can achieve a no-load input power of less than 50 mW at 400 VDC input and provide a continuously regulated output, easily meeting the world's most stringent no-load and standby efficiency standards.
The HiperLCS-2 devices operate with high efficiency across the entire load range, with such low dissipation that only direct heat transfer through the FR4 printed circuit board is required, eliminating heatsinks in adapter designs up to 220 W continuous output with a 170 percent peak power capacity. All members of the HiperLCS-2 family feature self-powered startup and provide startup bias for a PFC stage using the company's HiperPFS™ ICs. Secondary-side sensing provides sub-one percent regulation accuracy across the entire line and load range and under power variations. The use of Power Integrations' FluxLink technology for high-speed digital feedback control with safety isolation provides significantly faster transient response and far superior long-term reliability compared to optocouplers.
Availability and Resources
: A reference design, DER-672, is available for download for designers who wish to evaluate the HiperLCS-2 ICs. Pricing for the HiperLCS-2 starts at $3.20 per chipset in quantities of 10,000 units. For more information, contact a Power Integrations sales representative.
