They are suitable for a wide range of demanding power applications, including switched-mode power supplies (SMPS) in servers, data centers, and communications equipment, uninterruptible power supplies (UPS), electric vehicle charging stations, and power conditioners for photovoltaic (PV) inverters.
Compared to lead-based packages such as the TO-247 and TO-247-4L(X), these new devices significantly reduce volume by more than 80%. This significant miniaturization directly contributes to improved power density in equipment. Furthermore, the surface-mount capability of the TOLL package allows the use of smaller parasitic impedance components, including resistors and inductors, which in turn leads to reduced switching losses.
The TOLL package is a 9-pin, 4-terminal package designed to facilitate the use of a Kelvin connection for its signal source terminal for gate drive. This advanced design minimizes the influence of inductance in the source lead within the package, thus achieving high-speed switching performance. For example, the TW048U65C exhibits a remarkable reduction in on-loss (Eon) of approximately 55% and off-loss (Eoff) of around 25% compared to the equivalent Toshiba product using the TO-247 package without a Kelvin connection. This improvement directly contributes to reducing power losses in equipment.
Toshiba's third-generation SiC MOSFETs feature optimized drift resistance and channel resistance ratio, resulting in good temperature dependence of the drain-source resistance (RDS(on)) across a wide range of operating conditions. They also exhibit low RDS(on) x gate-drain loads (Qgd), a crucial figure of merit (FOM), further enhancing their performance. All variants feature an absolute maximum drain-source voltage (VDSS) of 650 V and a wide gate-source voltage (VGSS) range of -10 V to 25 V, enabling compatibility with various gate control circuits and simplifying circuit design. The gate threshold voltage (Vth) of these devices typically ranges from 3.0 V to 5.0 V, further simplifying circuit design. Additionally, the high drain current (ID) ensures robust operation under demanding conditions, enhancing system reliability.
Nordic introduces the nRF54LC10A SoC for compact IoT devices
Nordic Semiconductor today introduced the nRF54LC10A system-on-a-chip (SoC), compatible with Bluetooth® Low Energy (LE), Bluetooth Channel Sounding, Thread, Zigbee, and Matter. The entry-level nRF54LC10A is the smallest and most energy-efficient multiprotocol SoC in the nRF54L series, combining...
