The efficiency of distributed power and the higher system density overcome the limitations of conventional 12V input multi-phase voltage regulators that lack current multiplication. Power-on-Package (PoP) technology enables the delivery of high currents to processors for AI applications and autonomous 48V control systems.
Power-on-Package modules are based on Factored Power Architecture (FPA) systems implemented in high-performance computers and large data centers. FPA allows for efficient distributed power delivery and direct conversion from 48V to the XPU below 1V. With current multiplication implemented very close to the high-current processors, MCM PoPs overcome existing barriers to improved performance.
A pair of MCM4608S59Z01B5T00 (MCM) and one MCD4609S60E59H0T00 (Modular Current Multiplier Driver, MCD) deliver 600A continuous current and up to 1000A peak current at 1V. Thanks to their high density, low-profile package (46 x 8 x 2.7mm), and low noise, the MCMs are suitable for integration in the same package as the XPU substrate or adjacent to it. Proximity to the XPU eliminates a substantial portion of the power losses and bandwidth limitations that occur in the final segment of the current supply path from the limits of the 12V multi-phase regulators.
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- Category: Integrated Circuits
Power-on-Package system with peak current up to 1000A
Vicor Corporation introduces a new Power-on-Package (PoP) circuit design consisting of Modular Current Multipliers (MCMs) for graphics processors, CPUs, and ASICs (XPUs). The PoP MCMs multiply the current and divide the voltage from a 48V source located close to the XPUs to enhance their performance.
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