In recent years, the increasing sophistication and power requirements of compact devices have necessitated the use of larger batteries, which, however, reduce the space available for mounting components. At the same time, there is a limit to battery size, so minimizing energy loss from mounted components is essential to ensure more efficient battery energy use.
To address this need, the development of wafer-level chip-sized packages (WLCSPs) is becoming commonplace in the industry. These packages contribute to greater miniaturization while maintaining the necessary characteristics. ROHM leverages its strengths as an integrated circuit manufacturer to significantly reduce wiring resistance (which has increased with conventional discrete processes). The result is a compact power MOSFET that offers low power loss.
The RA1C030LD is offered in the wafer-level chip-sized DSN1006-3 package (1.0 mm × 0.6 mm), which leverages ROHM's proprietary IC process to achieve low power dissipation and further miniaturization. In terms of the factor of merit, which expresses the ratio between conduction and switching losses (conduction resistance × Qgd), an industry-leading value has been achieved that is 20% lower than that of standard packaged products in the same size package (1.0 mm × 0.6 mm or smaller). This contributes to a significantly smaller board area and increased efficiency in a wide range of compact devices. Simultaneously, ROHM's unique package structure provides insulating protection for the sidewalls (unlike standard products in the same package without this protection). This reduces the risk of short circuits due to contact between components in compact devices that must resort to high-density assemblies due to space limitations, thus contributing to safer operation.
In the future, ROHM will continue to develop products with even lower conduction resistance in smaller packages that contribute to solving societal problems such as environmental protection by improving efficiency in a wide variety of compact devices.
Specs
Application examples
Audible devices (e.g., wireless headphones)
Wearable devices such as smartwatches, smart glasses, and action cameras
Smartphones
They are also suitable for switching in a wide range of thin and compact devices.
