By seamlessly combining 3D rendering functions with integrated audio DSP and other peripheral functions, the single-chip SoC supports instrument consoles as well as in-vehicle infotainment (IVI) systems with screen audio and other capabilities.
The R-Car E3 is a step up from its predecessor, the R-Car D3 SoC for 3D graphics consoles, delivering enhanced 3D graphics rendering performance. As part of the Renesas R-Car family, the new SoC also offers essential safety and security features for connected cars, where the role of the human-machine interface (HMI) is becoming increasingly important. With these features, the R-Car E3 simplifies the development of robust systems capable of reliably handling both malfunctions and cyberattacks.
The single-chip design enables the integration of a variety of systems, reducing overall system development costs and achieving substantial space savings. The R-Car E3 shares the scalability of the R-Car H3 and R-Car M3 for integrated dashboards, as well as the R-Car D3 for instrument clusters, establishing the highest level of software reuse. Renesas' partner companies, with extensive experience in the instrument cluster field, are ready to provide operating system (HMI) and HMI tools in addition to system integration support. This will significantly reduce the development burden, extending software support to a wide range of vehicles, from the premium class, which currently benefits from high-end 3D graphics, to first-class vehicles where integrated systems and full graphics are expected to become mainstream.
Renesas works with several operating system manufacturers, HMI manufacturers, and systems integrators that are leaders in the instrument cluster and IVI fields. System developers can leverage a wide range of automotive solutions by working with the more than 250 partner companies of the Renesas R-Car Consortium to further reduce the number of development steps and the cost of 3D graphics in vehicles ranging from entry-level to premium.
