Cinch Connectivity Solutions, a Bel Fuse company, introduces its heavily ruggedized H28-100G-SR4 transceiver. This new product features a BGA mounting bracket and electrical interposer, making it an ideal, space-saving solution for engineers.
The four TX channels and four RX channels utilize a custom route fiber ribbon that maintains high performance in extreme temperatures ranging from -40°C to 85°C, all at a data rate of 25.78 Gbps per channel up to a total of 100 Gbps.
ROHM has developed four models as part of the TRCDRIVE pack™ series with 2-in-1 molded SiC modules (two with a power rating of 750 V: BSTxxxD08P4A1x4 and two with a power rating of 1200 V: BSTxxxD12P4A1x1) optimized for traction inverters in xEVs (electric vehicles). The TRCDRIVE pack™ supports up to 300 kW and features high power density and a unique terminal configuration, helping to address the main challenges of traction inverters in terms of miniaturization, increased efficiency, and reduced labor hours.
KIOXIA Europe has announced that its first personal SSDs feature a heatsink for improved heat dissipation. Designed specifically for PCs and PlayStation 5 with an M.2 connector[1], the KIOXIA EXCERIA series of heatsinked SSDs is easy to install right out of the box [2], is available in 1024GB, 2048GB, and 4096GB capacities, and offers advanced heat dissipation properties for gaming systems that require extra cooling during intense gaming sessions.
Cinch Connectivity Solutions, a Bel Fuse company, announced today that it now has in stock the QPS (Qualified Parts for Space) terminations from Midwest Microwave Solutions.
Midwest Microwave offers space-rated SMA terminations designed to meet aerospace and military industry standards, suitable for high-grade satellites, deep space exploration, and vacuum chamber testing. With three standard shielding levels and male and female versions available, engineers have greater flexibility and versatility for a variety of applications.
Each unit undergoes rigorous qualification and shielding processes guided by MIL-DTL-39030, meeting or exceeding 1% Total Mass Loss (TML) and 0.1% Collected Condensable Volatile Materials (CVCM). Midwest Microwave QPS terminations are engineered to deliver consistent performance and meet stringent standards without compromise.
“As a qualified supplier, we are pleased to offer high-quality space mission solutions that help engineers delve into the exciting new realm of exploration,” said Pete Bittner, president of Cinch. “We look forward to supporting designers who make it possible to navigate rugged terrain and extreme altitudes.”.
A busbar is essentially a metal component with very low ohmic resistance used to transmit large amounts of energy as efficiently as possible. When we talk about large amounts of energy, we can refer to very high currents (ranging from 200 A to 5 kA) or very high voltages.
The materials used to create a busbar are usually copper or aluminum with plating treatments of nickel, tin, silver, or gold, depending on the application requirements.
Based on the manufacturing process and performance characteristics, busbars can be classified as flexible, rigid, or laminated.
Power Integrations has announced the launch of the SCALE-iFlex™ XLT family of dual-channel plug-and-play gate drivers for operating single semiconductor modules LV100 (Mitsubishi), XHP™ 2 (Infineon), HPnC (Fuji Electric) and equivalents up to 2300 V blocking voltage for wind, energy storage and renewable solar power installations.
ENNOVI presents an innovative approach to laminating the Cellular Contact System (CCS). ENNOVI uses qualified polyethylene terephthalate (PET) adhesives and insulating sheets from multiple suppliers, testing them for bonding strength, durability, and environmental impact.
Panasonic's hydrogenated amorphous silicon (a-Si:H) solar cells, known as Amorton, power indoor and outdoor applications such as IoT devices, clocks, sensor nodes, asset trackers, and remote controls. Amorton can reliably and sustainably harvest energy even in low-light and artificially lit environments.
Developers of electronics for spacecraft use radiation-tolerant (RT) FPGAs (field-programmable gate arrays) to ensure high levels of performance, reliability, energy efficiency, and best-in-class security against emerging threats in the space environment. Microchip Technology has introduced the PolarFire® RT FPGA SoC (system-on-chip) to take this a step further and facilitate rapid and cost-effective software customization.
Toshiba Electronics Europe GmbH ("Toshiba") has launched a new range of 650V N-channel power MOSFETs. The TK042N65Z5 and TK095N65Z5 in TO-247 packages are the first high-speed diode (HSD) products in the next-generation DTMOS VI series. This generation features a superjunction structure suitable for switched-mode power supplies in demanding applications such as data centers and power conditioners for photovoltaic (PV) generators.
The automotive industry is evolving towards 48V zonal architectures, hence engineers designing power systems are looking for new high-voltage power solutions that offer the best levels of power density, weight and scalability.
Vicor will present five technical papers at World Congress Experience 2024 (WCX™) in Detroit from April 16-18 detailing its innovative approach to 800V and 48V power conversion, using high-density scalable power modules based on proprietary topologies and innovative packaging.
Pulsiv Limited will launch a series of reference designs and assembled modules for USB-C applications that will offer average efficiency exceeding 95%. This pioneering achievement, which minimizes energy waste under all operating conditions, was developed in collaboration with Innoscience and Frenetic. The designs will be released throughout 2024 to support a new class of sustainable USB-C chargers, adapters, and wall sockets. The first 65W solution is expected to be announced in late March 2024.
Feasycom, represented by Mecter SL in Spain and Portugal, offers various solutions for developing Bluetooth-enabled devices, from Bluetooth Classic modules for serial transmission to Bluetooth Low Energy (BLE) platforms based on Nordic Semiconductor SoCs.
One of...
Same Sky® and its Audio division have announced the release of test boxes for speaker prototyping. These boxes, which initially accommodate miniature rectangular speaker frames of 15 x 11 mm, 16 x 9 mm, and 18 x 13 mm, create an acoustic cavity of approximately 1 cc...
Advanced Energy Industries, Inc. has announced a new 1100W power factor correction (PFC) module for board mounting: the industry's first solution of its kind in a "half-brick" form factor.
The Advanced Energy AIH03ZPFC model is designed for applications in systems...
Ezurio's Vela IF310 modules combine Bluetooth Classic and Bluetooth LE 6.0 connectivity with advanced audio features, enabling reliable wireless communication for automotive, medical, and industrial applications.
With the HSI-H-MTD® cable set, Rosenberger presents a hybrid connectivity solution that combines the proven HSI (High-Speed Implement Bus) connector system on the tractor side with the compact H-MTD® high-speed data connector on the trailer side.
The Texas Instruments CC330xMOD SimpleLink™ modules allow developers to quickly and easily incorporate advanced wireless connectivity into embedded systems, significantly reducing design complexity and time to market.
The Telit Cinterion SL871K2 GNSS module is designed to provide accurate and reliable positioning for advanced IoT and navigation applications. This single-frequency, multi-constellation receiver can simultaneously track up to four GNSS constellations, including GPS,...
SparkLAN, represented in Spain and Portugal by Mecter SL, offers three industrial-grade wireless modules in its catalog, covering a technological transition from Wi-Fi 5 and Wi-Fi 6E to the advanced Wi-Fi 7. This range allows developers to choose the most suitable solution for...
Siemens, in close collaboration with NVIDIA, announced that its Veloce™ proFPGA CS hardware-assisted verification and validation system is enabling system designers and architects to create more optimized designs by running and capturing billions of verification cycles before...
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