This device is based on a dual-mold package that integrates the 12-bit resolution semiconductor position sensing device with the necessary decoupling capacitors to meet the stringent electrostatic discharge (ESD) and electromagnetic compatibility (EMC) requirements of the automotive environment. Once assembled, this dual-mold package can be soldered directly to a robust connector or termination for subsequent impregnation or overmolding. The dual-mold package eliminates the need for a conventional printed circuit board configuration. Its special pins allow for greater assembly precision.
This sensor device can be used in linear or rotary position sensing applications. It offers fully programmable transfer functionality, selectable analog and pulse-width modulation (PWM) output modes, open/short circuit diagnostics, built-in diagnostics, undervoltage detection, and overvoltage protection. A version compliant with SENT-SAE J2716 is currently under development.
“The MLX90364 meets the automotive industry’s demand for greater electrical, mechanical, and environmental robustness,” emphasizes Vincent Hiligsmann, Marketing Director for Sensors at Melexis. “The combination of dual-mold packaging and our latest generation of Triaxis® position sensor ICs eliminates the vulnerability often associated with printed circuit boards when exposed to high temperatures or vibration. With more than three fewer components and solder joints, the risk of failure is significantly reduced. The board-less assembly, along with contactless sensing, provides a fully optimized solution for long-term, reliable performance.” “Melexis is already supplying its NoPCB solution to several Tier 1 automotive suppliers worldwide, and this announcement makes it available to the entire market,” he concludes.
The MLX90364 is approved according to AEC-Q100 and Q200 automotive standards. It has passed extreme validation tests to verify its robustness, such as long periods of exposure to ambient temperatures of up to 170°C.
