Parker Chomerics' EMI CHOFORM® 5575 Form-In-Place (FIP) gasket is a robot-dispensed material that can be applied directly onto the drone's aluminum casting to act as a barrier, preventing electrical circuits from communicating with each other and causing premature failure.
CHOFORM 5575 is a moisture-cured, silver-plated aluminum-filled silicone material that offers shielding effectiveness of up to 80 dB.
Using an FIP gasket saves up to 60% of space and weight in the drone housing, as the flanges can be as narrow as 0.025 in (0.76 mm).
CHOFORM 5575 has high corrosion resistance when dispensed onto aluminum, preventing galvanic corrosion in the electronic enclosure.
To mitigate the thermal effects, Parker Chomerics developed THERM-A-GAP™ GEL 37. With a thermal conductivity of 3.7 W/mK, this product is used to conduct heat from the chipset to the drone's housing.
This one-component, pre-cured thermal gel material can be dispensed directly onto the chipset using automation, significantly reducing production time. THERM-A-GAP GEL 37 has a smooth, paste-like consistency, eliminating any stress on electronic components and requiring no mixing or curing.
