This two-component liquid adhesive can be stored without refrigeration and achieves high bond strength after heat treatment.
Liqui-Bond SA 3505 has a thermal conductivity of 3.5 W/m•K, previously unavailable in a structural adhesive, and offers a shear strength of 3.15 MPa after heat treatment. Its high bond strength allows its use in numerous applications, such as printed circuit board bonding, providing a quick and easy alternative to conventional solutions. Furthermore, its elastic properties help alleviate stresses induced by the coefficient of thermal expansion (CTE) during thermal cycling. For applications where strength or dielectric integrity are of paramount importance, Liqui-Bond SA 3505 can be ordered with 0.18 mm or 0.25 mm glass insulating spheres.
The adhesive's thixotropic properties facilitate its flow during assembly with minimal stress on fragile components, ensuring that the fluid remains in place until treatment. Its pseudo-plastic characteristics allow for optimized dispensing, and its availability in cartridges or kits enables use with manual or automatic dispensing equipment.
Curamik® Endurance Direct Bond Copper Ceramic Substrate
Rogers Corporation's Advanced Electronics Solutions (AES) group introduces curamik Endurance substrates, which are direct-bond copper ceramic substrates with enhanced properties. curamik® Endurance substrates provide improved reliability performance compared to...
