This advancement allows the company to offer the unique advantages of Fusion's mixed-signal integration to the military, avionics, and defense sectors, where highly reliable operation at extreme temperatures is essential. Designers can leverage the inherent reprogrammability, high reliability, and non-volatility of Fusion devices, which also offer the added benefit of immunity to firmware errors. Furthermore, by offering analog and digital integration on a single chip, Fusion's mixed-signal FPGAs significantly reduce board footprint.
The Fusion FPGAs, tested across the entire temperature range from -55°C to +100°C, are available with 600K densities and 1.5M system gate equivalents, and up to 223 user I/Os. Functions such as sequential power connection and monitoring, as well as voltage, temperature, and current monitoring, can now be easily implemented at extreme temperatures. These mixed-signal FPGAs for an extended temperature range are an ideal solution for high-reliability applications such as weapons systems and down-wing systems in aircraft that must operate in extreme environments.
“For applications such as industrial and military applications exposed to harsh environments, it is essential to use highly reliable components,” said Ken O’Neill, director of marketing for high-reliability products at Microsemi. “Thanks to our track record as suppliers of highly reliable devices and our testing at these extreme temperatures, we continue to offer significant added value in our unique offering, which is specifically targeted at the military and aerospace markets.”.
