It provides complete switched-mode power in a single package with full electrical performance across the MIL temperature range of -55°C to +125°C, and its terminals are tin-plated to ensure optimal long-term reliability. Full traceability is provided through assembly and testing via tracking code/date assignment, and Intersil offers enhanced process change notification.
Combined with load current scalability and expanded terminals in its QFN package, the ISL8200MM is ideal for defense communications equipment, radar, sonar, ground defense vehicles, and smart weapon systems.
The ISL8200MM utilizes Intersil's patented current-sharing architecture to reduce PCB topology noise sensitivity when modules are used in parallel. The device incorporates nearly all the components needed to deliver a plug-and-play solution, replacing up to 40 different components. This high level of integration simplifies and accelerates designs while reducing the power management footprint.
A thermally efficient, 23-pin QFN (15 mm x 15 mm) package enables output power levels of 60W. High-power internal components such as the power MOSFET and inductors are soldered directly to conductive pads, allowing for efficient heat transfer to the PCB. The use of thermal vias on the PCB provides a typical thermal resistance (qJA) of only 13°C/W. Because most heat transfer occurs through the PCB, airflow is generally not required.
The module's QFN package has terminations around its perimeter, allowing access to the pins for cleaning and solder verification. The low 2.2 mm profile of the ISL8200MM allows it to be mounted on the underside of a PCB with other low-profile components.
