The proven reliability of RTG4™ FPGA technology and decades of spaceflight experience mean they do not need to fully pass the QML (Qualified Manufacturers List) procedures.
“This milestone is very important for system designers who need large quantities of low-cost components for space applications with reduced lead times, so they can keep pace with shorter service launch cycles,” said Ken O’Neill, associate director of marketing for space and aviation in Microchip’s FPGA business unit. “RTG4 FPGAs offer very high levels of reliability and radiation shielding, while maintaining low cost through plastic packages and sub-QML evaluation.”.
The Microchip RTG4 Sub-QML FPGA is JEDEC certified in a 1657 flip-chip BGA (ball grid array) plastic package with a 1.0 mm pitch. Its pins are compatible with the company's QML Class V certified RTG4 FPGAs in ceramic packages, facilitating the migration of designs between new space missions and the more demanding Class 1 applications. The plastic-packaged RTG4 Sub-QML FPGAs are also available as prototypes in small quantities, allowing designers to evaluate the product and develop prototype systems before committing to large-scale, flight-ready production orders.
Other Microchip products available in plastic packages for space systems include its LX7730 telemetry controllers, its LX7720 position and motor sensing controllers, and high-reliability plastic versions of its microcontrollers and microprocessors, Ethernet physical layer (PHY), A/D converters (ADCs), and flash memory and EEPROM.
Availability
The JEDEC-approved Sub-QML RTG4 FPGA in 1657 plastic BGA packaging is now in production.
