dpakThe new product, "TK55S10N1," achieves low turn-on resistance by combining a chip from the "U-MOS VIII-H series" manufactured using the latest eighth-generation trench MOS process with a "DPAK+" package that utilizes copper connectors. The product is particularly well-suited for automotive applications, especially those requiring high-speed switching, such as switching regulators. Samples are now available, and mass production is scheduled to begin in April 2013.

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