The devices are 100% compatible with the industry-standard Power-SO8 footprint; no other compact surface-mount device yet meets UL2595, which requires minimum isolation distances and creepage distances of 1.5 mm between the Source and Drain terminals.
Unlike some competing Power-SO8 types that are constructed by bonding wires, Nexperia's LFPAK56 package uses a copper clamp that is soldered to the die surface in a single operation. This reduces leakage resistance and gives the LFPAK56 superior electrical and thermal characteristics, as well as increased reliability. The new PSMN0R9-30ULD and PSMN1R0-40ULD N-channel MOSFETs in the improved SOT1023A package feature a 1.5 mm leakage distance and a 1.55 mm separation distance. The PSMN0R9-30ULD is rated at 30 V, delivering 0.87 mΩ and 300 A, while the PSMN1R0-40ULD is rated at 40 V, delivering 1.1 mΩ and 280 A.
According to Eric Su, International Director of Product Marketing: "UL2595 is an important US standard that could be adopted by other international regulatory bodies. Furthermore, equipment manufacturers prefer to design a global product that meets the most demanding standards, rather than having multiple versions for different geographical locations. Therefore, it is important for designers to be aware that standard Power-SO8 devices will not pass UL2595, but that an adaptable replacement is available.".
The PSMN0R9-30ULD and PSMN0R9-40ULD MOSFETs are part of Nexperia's NextPowerS3 family of devices that offer a combination of low RDS (on), high peak current and safe operating area (SOA), perfect for battery motor control applications.
