The TLP5814H is a highly integrated gate driver featuring a built-in active Miller clamping circuit that enhances system safety and reduces overall solution size by minimizing the number of additional external components required.
The integrated active Miller clamping circuit in the TLP5814H has a channel resistance of 0.69 Ω (typical) and a maximum clamping current of 6.8 A. These characteristics help prevent the self-turn-on phenomenon associated with some power devices, such as SiC MOSFETs and insulated-gate bipolar transistors (IGBTs), which are highly sensitive to changes in gate voltage. The active Miller clamping circuit in the TLP5814H reduces system cost, size, and complexity by eliminating the need for designers to include an additional negative power supply and implement an external active Miller clamping circuit.
This gate driver photocoupler can provide a maximum output current of +6.8/-4.8 A with rail-to-rail output, helping to improve system switching performance and ensure stable operation. Internal Faraday shielding ensures common-mode transient immunity of ±70 kV/µs (min.).
The TLP5814H can operate reliably in temperatures ranging from -40 to 125 °C thanks to the enhanced optical output of the infrared light-emitting diode (LED) on the input side and an optimized high-gain, high-speed photodiode array, which helps improve optical coupling efficiency.
To enhance board design flexibility, the TLP5814H is offered in a small SO8L package measuring only 5.85 × 10 × 2.1 mm. Furthermore, it has a minimum creepage distance of 8.0 mm, making it suitable for use in applications requiring high insulation performance.
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