These diodes are suitable for use, for example, in DC-DC conversion, freewheeling, reverse polarity protection, and OR-ing applications.
For maximum design flexibility, this portfolio expansion offers reverse voltages VR(max) ranging from 20 V to 60 V and forward currents IF(average) of 1 A and 2 A. The exposed heatsink of the CFP2-HP allows for maximum thermal dissipation (Ptot) in a compact package. The dimensions of the CFP2-HP package are 2.65 mm x 1.3 mm x 0.68 mm (including leads).
“As the industry transitions to multilayer printed circuit boards, a trend driven by the growing popularity of high-performance microcontrollers, packaging is becoming a crucial part of the thermal system. Smaller packages, such as CFP, which offer more efficient heat dissipation, are a key part of Nexperia’s commitment to actively contributing to this shift,” says Frank Matschullat, Head of the Discrete Bipolar Power Products Group at Nexperia. “Modern CFP packaging technology, designed for multilayer PCBs, delivers the same electrical performance in a smaller footprint, reducing both component and system costs. Thanks to significant investments in capacity expansion, we are well-positioned to meet the growing demand for CFP-packaged products. These are essential for future-proofing industrial and automotive applications in the face of increasing demands and ensuring market competitiveness.”.
Thanks to their copper clip design, these packages meet the demanding requirements for efficient and space-saving designs. Currently, the CFP package is used in various power diode technologies, such as Nexperia's Schottky diodes and recovery rectifier diodes, and will soon be expanded to bipolar transistors. It offers a wide range of products. This further solidifies Nexperia's position as a leader in package innovation, offering customers the broadest range of device options from a semiconductor manufacturer with a reliable supply chain.
