They feature a compact rectangular form factor with multiple rows of precision-engineered pins or sockets, available in a wide variety of pin counts and configurations. The low-profile design allows for use in space-constrained applications while maintaining signal integrity and long-term reliability.
Designed for surface mount technology (SMT), Micro-D connectors are soldered directly onto the copper pads of the printed circuit board (PCB), enabling efficient assembly and robust electrical performance.
Technical features include a contact resistance of up to 8 milliohms at the contact interface, plus the additional resistance of the conductors depending on the cable gauge, measured at 2.5 A. They support a rated current of up to 3 A and provide a dielectric strength of 600 VAC at sea level and 150 VAC at 70,000 feet, with a leakage current limited to 1 mA. The insulation resistance is at least 5000 megohms at 500 VDC, contributing to reliable operation in demanding environments.
