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Verge Motorcycles, a technology company and electric motorcycle manufacturer, has created its B2B division, Verge Next, with the aim of accelerating the electrification of transportation and helping two-wheeler manufacturers create even better and more innovative products. Licenses for Verge's technology platform, which integrates advanced and seamless technical solutions, are now available worldwide.
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Industrial Shields has signed a distribution agreement with Sfera Labs, a provider of open-source hardware and software solutions for professional automation. Under the terms of the agreement, Industrial Shields will offer Sfera Labs' main product lines, including Strato Pi servers, Iono Pi PLC and I/O modules, and Exo Sense environmental sensors.
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Kontron AG and Exein have announced a strategic alliance that will integrate Exein's cutting-edge cybersecurity technology into Kontron's advanced solutions.
Thanks to this collaboration, Exein's technology becomes a standard security feature of KontronOS
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New statistics from World Robotics 2025 on industrial robots show that 542,076 robots were installed in 2024, more than double the number from 10 years ago. Annual installations exceeded 500,000 units for the fourth consecutive year. Asia accounted for 74% of new installations in 2024, compared to 16% for Europe and 9% for the Americas.
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The EU automotive industry installed 30,650 industrial robots in 2024. This represents a year-on-year decrease of 5%. Six of the top ten vehicle-producing countries in the EU recorded double-digit losses. This is according to the World Robotics 2025 Industrial Robots report, presented by the International Federation of Robotics (IFR).
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Siemens Digital Industries Software has announced a collaboration with Advanced Semiconductor Engineering, Inc. (ASE) to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens' Innovator3D IC™ solution, which is fully certified to the 3Dblox standard.
Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies, including Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and 2.5D and 3D ICs based on Through Silicon Via (TSV).
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Siemens Digital Industries Software has announced multiple new collaborations with TSMC, including product certifications and innovative design solution enablement initiatives for the newest and most advanced foundry process technologies.
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At Huawei's Global Power Summit held during HUAWEI CONNECT 2025, Huawei released the Global Digitalization and Intelligence Index (GDII) Report for the power sector. This report aims to provide quantitative assessment tools and strategic guidance for building future power systems for global power companies as they digitize.
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ROHM and Infineon Technologies AG have signed a memorandum of understanding to collaborate on silicon carbide (SiC) power semiconductor packages used in applications such as embedded chargers, photovoltaics, energy storage systems and AI data centers.
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Mr. Tim Kruse, from the Department of Mechanical and Electrical Engineering at the University of Southern Denmark, was awarded the EPCIA Student Award at the 5th Passive Components Symposium (PCNS), held on September 12, 2025 in Seville, Spain, for his outstanding doctoral thesis work.
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Mouser Electronics, Inc. announces a global distribution agreement with Quantic Evans, a supplier of high-energy-density capacitors for critical applications. Quantic Evans' hybrid capacitors, known as EVANSCAPS, are used in a variety of markets, including aerospace, energy, and communications.
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EnSilica and Codasip announce a strategic alliance to enable custom ASICs incorporating CHERI (Capability Hardware Enhanced RISC Instructions), post-quantum cryptographic acceleration (PQC), and advanced system-level security and protection features. These will serve industry, automotive, and critical national infrastructure, including defense and aerospace applications.
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duagon, a leading global specialist in embedded electronics for the rail and medical sectors, will celebrate its 30th anniversary at the end of September 2025. The company, headquartered in Dietikon, Switzerland, supplies its customers with innovative embedded electronics that comply with the latest standards. Its robust and reliable technology is available long-term, both as individual components and complete IT systems.
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Cyient Semiconductors, a provider of custom ASIC/ASSP and smart energy solutions, has announced a strategic alliance with Anora, a global provider of semiconductor testing, testability, and validation services. The collaboration combines complementary strengths to provide comprehensive, end-to-end solutions for semiconductor product development.
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On its 60th anniversary, Salicru reaffirms its leadership in power electronics solutions, with a growth plan based on proximity to the customer and distributor, internationalization, innovation and the ability to offer tailor-made projects for critical sectors.
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Vertiv Holdings Co today announced the acquisition of Waylay NV, a Belgian company specializing in hyperautomation software platforms and generative AI, as part of its ongoing investment in AI-based monitoring and control technologies for its power and cooling systems.
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Bornay Aerogeneradores held the official launch of the Tesla Powerwall 3 at its facilities this Tuesday. The Powerwall 3 is a home battery that combines energy storage and grid connection in a single unit. The presentation was given by Juan Antonio Espada, Account Manager for Spain and Portugal, and Gonzalo García, Technical Manager for Spain, both representing Tesla.
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To support customer choice, Anglia Components Plc has created a new company, ADIOS Electronics Ltd. However, unlike the traditional intermediary model, where components are procured according to customer needs, ADIOS will maintain stocks of the most in-demand products.
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Qualcomm Technologies, Inc. and Valeo have announced the expansion of their long-standing collaboration to deliver advanced driver assistance systems (ADAS) and autonomous driving (AD) solutions to the global automotive industry.
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Bcnvision Group today announced a strategic agreement that will transform the industrial machine vision landscape in the Iberian Peninsula. The company is integrating the product range of the PYGSA and INVES Control brands, both part of the Iberia Advanced Vision System structure, into its portfolio.
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AIMPLAS, the Technological Institute of Plastics, has extended Recyclass recognition to its laboratories to assess the recyclability of plastic materials used in the automotive and electrical-electronic sectors.
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Farnell will distribute connectivity solutions from Digi International, a global provider of Internet of Things (IoT) connectivity products, services and solutions, expanding Avnet's existing relationship with Digi and enhancing Farnell's wireless communications portfolio.
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Global technology solutions provider Arrow Electronics, Inc. announced the addition of AirBorn, a Molex company, to its portfolio of interconnect, passive, and electromechanical (IP&E) components in North America and EMEA. The addition of AirBorn to Arrow's product offering reinforces the long-standing and deep collaboration between Arrow and Molex.
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Large-format 3D printing has established itself as a key technology in demanding industrial sectors such as automotive and urban design, thanks to its ability to manufacture large parts without assembly. However, its large-scale adoption faces significant technical challenges such as warping and cracking, caused by thermal stresses during the manufacturing process.
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