Other Semiconductors
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Renesas Electronics Corporation has unveiled a new automotive intelligent power delivery device (IPD) that will safely and flexibly control power distribution within vehicles, meeting the requirements of next-generation E/E (electrical/electronic) architectures.
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Interview with Bob Martin, Senior Applications Engineer, MCU8 Business Unit, Microchip Technology
How will IoT revitalize the semiconductor industry and play a key role in “Industry 4.0”?
Microchip:
A more appropriate term is "reorienting" from personal biometric applications and autonomous vehicles to applications focused on the thousands of processes and machines that operate 24 hours a day, every day of the year globally within the industrial segment.
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Toshiba Electronics Europe GmbH ("Toshiba") has launched five 1200V silicon carbide (SiC) MOSFETs that leverage the company's third-generation SiC technology to boost energy efficiency in high-voltage industrial applications. These are used in equipment such as electric vehicle charging stations, photovoltaic inverters, industrial power supplies, uninterruptible power supplies (UPS), and bidirectional or half-bridge DC-DC converters.
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Nexperia has announced the launch of a new range of 20V and 30V MOSFETs in the world's smallest DFN package, the DFN0603. Nexperia already offers ESD protection devices in this package, but has now managed to incorporate it into its MOSFET portfolio, a feat that remains unmatched in the industry.
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Melexis introduces the MLX90381 pico resolver, which complies with the AEC-Q100/ISO 26262 standard and offers ease of use and reliability for industrial and automotive applications. Its tiny DFN-6 package (2 mm x 2.5 mm) enables mechatronic miniaturization with sensors. This ASIL-ready solution is programmable at the module level and is ideally suited for rotor position detection.
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Melexis presents the MLX90397, a 16-bit, 3-axis sensor with a magnetic field range up to 50 mT (with an adaptive range on the z-axis up to 200 mT). Users can select the fields to measure from BX, BY, BZ, temperature, or a combination thereof. The sensor element is based on the proven Triaxis® 3D Hall effect technology. Captured data is converted to digital form and transferred via an I2C interface.
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Renesas Electronics Corporation has introduced the RZ/T2M high-performance motor control microprocessor units (MPUs) for applications such as AC servo drives and industrial robots. The RZ/T2M combines fast, highly accurate, real-time motor control capabilities with the latest Industrial Ethernet on a single chip, while also supporting functional safety operation.
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Renesas Electronics Corporation has introduced an AUTOSAR-compatible complex device driver (CDD) software module for electric vehicle (EV) battery management system (BMS) designers. The new software is paired with Renesas' ISL78714 lithium-ion battery management IC to accelerate the design and optimize the performance of next-generation systems.
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Renesas Electronics Corporation has introduced the industry's first I3C intelligent switching devices for next-generation server motherboards and other infrastructure equipment. The new chips greatly improve scalability and reliability while reducing the complexity of high-performance system designs.
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ROHM has added seven new devices, the R60xxVNx series, to its PrestoMOS™ range of 600V Super Junction MOSFETs, distinguished by their class-leading low on-resistance and the industry's fastest reverse recovery time (trr). The R60xxVNx series is optimized for power supply circuits in industrial equipment requiring high power
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The AIROC™ CYW20835 low-power Bluetooth® SoC (system-on-a-chip) is a Bluetooth® device compliant with Core 5.2 specifications for IoT applications. It provides high levels of integration to minimize the number of external components required, reducing device size and the costs associated with deploying low-power Bluetooth®-connected applications.
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Mouser Electronics, Inc. is expanding its comprehensive portfolio of home automation solutions from a wide range of manufacturers, including products from NXP Semiconductors, Fingerprints, AP Memory, ScioSence, and Renesas Electronics. The new products and technologies enable designers to bring intelligence to all types of devices, from gas meters to washing machines, improving measurement, proximity sensing, and data processing.
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