Beneq Transmute™ extends the performance of the Beneq Transform® XP platform to production environments with Beneq's patented three-step ALD architecture. By combining plasma pretreatment, plasma-enhanced ALD (PEALD), and batch thermal ALD, the platform delivers high-performance, conformal dielectric stacks with atomic-level interface control, now with high throughput.
Its 25-wafer chambers with uniform flow, along with advanced precursor dosing technology, enable fast cycle times, optimized wafer coverage, and reduced precursor waste, resulting in a low total cost of ownership across a wide range of semiconductor applications.
“Beneq Transmute™ represents a major step forward in transforming ALD into a high-volume manufacturing solution,” says Lucas Monteiro, product manager at Beneq. “By combining the precision of ALD with throughput and scalability that meet production demands, we offer our customers the ability to produce next-generation RF and broadband devices with high throughput and low total cost of ownership, with the uncompromising film quality for which Beneq is known.”.
Designed for specific production requirements,
Beneq Transmute™ supports thermal and plasma-enhanced ALD within a modular cluster architecture that allows for customized configurations. With up to two transfer chambers and eleven process module slots, including PEALD, thermal, buffer, and preheater modules, each system can be tailored to meet specific customer applications and factory roadmaps, while ensuring long-term scalability.
