Farnell today announced the availability of the 2040 chip, based on a Raspberry Pi design. This new chip, which forms the core of the $4 Raspberry Pi Pico, combines high performance, low cost, and ease of use.
Nexperia today announced new 0.55 mΩ RDS(on) 40 V power MOSFETs in the highly reliable LFPAK88 package for automotive (BUK7S0R5-40H) and industrial (PSMNR55-40SSH) applications. These devices are the lowest RDS(on) Nexperia has ever manufactured and, more importantly, offer power densities more than 50 times higher than traditional D2PAK devices.
ROHM has developed the industry's highest gate breakdown voltage (nominal gate-source voltage) technology (8V) for 150V GaN HEMT devices, optimized for power supply circuits in industrial and communication equipment.
Melexis has introduced the Triaxis MLX90377 single and dual-pad (fully redundant) position sensor for industrial and automotive applications along with a new PCB-free package for position sensors.
Power Integrations has announced the InnoSwitch™4-CZ family of high-frequency zero-voltage switching (ZVS) integrated circuits. InnoSwitch4-CZ devices incorporate a robust 750V primary switch utilizing Power Integrations' PowiGaN™ technology and a novel high-frequency active clamp flyback controller to enable a new class of ultra-compact chargers suitable for phones, tablets, and laptops.
Allegro MicroSystems, Inc. has announced the launch of the A31315 sensor, the latest member of the 3DMAG™ family of rotary and linear magnetic position sensor integrated circuits for industrial and automotive applications. 3DMAG sensors combine Allegro's proven planar and vertical Hall-effect technologies to measure magnetic field components along three axes (X, Y, Z), enabling true 3D sensing capabilities with a wide magnetic dynamic range without saturation.
The emergence of the Internet of Things (IoT), which leverages high-performance computing in the cloud and at the edge, has led to a significant increase in the data consumed by the applications we use to monitor everything from our mobility and personal well-being to the homes and offices we occupy. Thanks to this data, society is becoming smarter.
Power Integrations has introduced its InnoSwitch3™-AQ family of automotive-rated flyback ICs, available with a 900V-rated component, providing increased voltage headroom for electric vehicle inverter, battery management, and 400V and 800V climate control applications. The InnoSwitch3-AQ family combines primary and secondary controllers, as well as safety feedback circuitry, into a single IC.
Nexperia today expanded its portfolio of Trench Schottky rectifiers with devices up to 100 V and 20 A. The new components feature excellent switching performance and leading thermal efficiency. They are available in Nexperia's CFP (Clip Bond FlatPower) packages, which are significantly more compact than SMA/SMB/SMC components.
ROHM has developed the GMR320 series of shunt resistors with a power rating of 10 W. The GMR320 series is the highest power rating product in ROHM's high-power, low-ohm GMR series, designed for high-power applications in the automotive, industrial equipment, and household appliance sectors.
ROHM has developed four new 600V IGBT intelligent power modules (IPMs) in its BM6437x series, offering best-in-class low noise characteristics along with low losses, making them ideal for power conversion in inverters. These devices are used in compact industrial equipment, such as small-capacity motors for robots, as well as in household appliances, including air conditioners and washing machines.
Nexperia announces the volume availability of its second-generation 650V power GaN FET family, offering significant performance advantages over previous technologies and competing devices. With an RDS(on) performance of up to 35 mΩ (typical), the new power GaN FETs are targeted at single-phase AC/DC and DC/DC industrial switched-mode power supplies (SMPS) from 2 kW to 10 kW, particularly server and telecom power supplies that must meet the 80 PLUS® Titanium efficiency standard. The devices are also well-suited for solar inverters and servo drives in the same power range.
Available in a TO-247 package, the new 650V H2 power GaN FETs offer a 36% size reduction for a given RDS(on) value, improving stability and efficiency.
The cascaded configuration eliminates the need for complex drivers, accelerating time to market. The devices deliver outstanding performance in both hard-switching and soft-switching configurations, giving designers maximum flexibility.
Dilder Chowdhury, Strategic Marketing Director for GaN at Nexperia, explains: “Titanium is the most demanding of the 80 PLUS® specifications, requiring >91% efficiency under full-load conditions (>96% at 50% load). Achieving this level of performance in server power applications operating at 2 kW and above, using conventional silicon components, is complex and challenging. Nexperia’s new GaN power FETs are perfectly suited to an elegant, bridgeless totem pole configuration that uses fewer components and reduces both physical size and costs.”
Nexperia’s GAN041-650WSB GaN FETs are now available in high volume.
Product data sheets and quick learning videos.
Designers can see Nexperia's GaN FETs in action by visiting the Nexperia booth at PCIM Digital Days from May 3-7.
Analog Devices, Inc. has announced that its A²B 2.0 (Automotive Audio Bus) is now production-ready. As the next evolution of ADI's A²B technology, A²B 2.0 is designed to help original equipment manufacturers (OEMs) and Tier 1 suppliers in the automotive industry...
Maxim Integrated Products, Inc. has introduced the MAX98396 Class D/G speaker amplifier, boasting the industry's lowest noise and lowest standby power consumption. The 20V digital input audio power amplifier delivers 12.7mW of standby power to meet and exceed...
Melexis expands its range of magnetic sensing integrated circuits (ICs) with a dual-mold package (DMP) variant of the MLX90425. This new device, which maintains package consistency with the established MLX90364 and MLX90421 ICs,
At PCIM in Nuremberg, from May 10-12, 2016, ROHM Semiconductor will present its latest power supply innovations for high-speed switching and high-power performance, while also meeting the need for greater energy savings...
Mitsubishi Electric has introduced its sixth generation of MPD (Mega Power Dual) IGBT modules. These modules, designed for use in power converters such as large-capacity photovoltaic and wind power generation systems, are also suitable for other high-power applications...
Smart factories worldwide are leveraging advanced automation applications such as augmented reality, autonomous mobile robots, cobots, and industrial sensors. Even beyond the traditional production floor, automation is accelerating in environments such as...
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