The IRSM808-105MH and IRSM807-105MH half-bridge power modules, available in an ultra-compact 8x9x0.9mm PQFN package, offer a footprint up to 60 percent smaller than existing power ICs for three-phase motor control. This provides a very compact, heatsink-free solution for applications such as compressor drives for refrigeration, pumps for heating and water circulation, air conditioning fans, dishwashers, and automation systems.
About µIPM™:
IR's patent-pending µIPM™ product family offers a scalable power solution with the same pin configuration and package size. The µIPM product family, incorporating IR's most robust and efficient high-voltage FredFET MOSFET switches, specially optimized for variable frequency drives, and IR's most advanced high-voltage driver ICs, offers DC current ratings between 2A and 10A and voltages of 250V and 500V. This new IR-led offering for this market segment utilizes copper traces on the printed circuit board to dissipate heat from the module, thus reducing costs thanks to the smaller package design and eliminating the need for an external heatsink. Thanks to QFN standard package technology, assembly is simplified by eliminating the need for a second-stage push-in assembly and improving thermal performance compared to traditional dual-module in-line solutions.
Nordic introduces the nRF54LC10A SoC for compact IoT devices
Nordic Semiconductor today introduced the nRF54LC10A system-on-a-chip (SoC), compatible with Bluetooth® Low Energy (LE), Bluetooth Channel Sounding, Thread, Zigbee, and Matter. The entry-level nRF54LC10A is the smallest and most energy-efficient multiprotocol SoC in the nRF54L series, combining...
