Semiconductor components are the unsung heroes of space missions, ensuring reliability and performance in the extreme environment of space. For the past 60 years, Microchip has played a vital role in over 100 space missions, contributing to the success of some of the most historic milestones in space exploration. From the first successful American space mission in 1958 to the ongoing Artemis missions, these components have consistently proven their worth.
Toshiba Electronics Europe GmbH expands its 74AVC series dual-feed bus transceiver range with four new 1-bit components, 74AVC1T45NX, 74AVCH1T45NX, 74AVC1T45FU and 74AVCH1T45FU, and two new 2-bit components, the 74AVC2T45FK and 74AVCH2T45FK.
Murata Manufacturing Co., Ltd. introduces its MGJ1T series, a new range of 1W surface-mount DC-DC converters with 6kV DC isolation. The series is designed to power high-side and low-side gate control circuits in demanding inverter, power conversion, and motor control systems.
Electric mobility needs batteries that get more out of each cell, not just those with greater capacity. With the ONE Inverter concept, engineering firm IAV and Nexperia are exploring a new approach to high-voltage architectures. This concept allows for more efficient use of the battery's available capacity.
ROHM has developed the TSC3PAK package (14.00 × 18.58 × 3.50 mm) for SiC MOSFETs. By adopting a top-mounted heat dissipation structure that places the heat dissipation surface on the top side of the package,
AI workloads continue to grow, which means data center architects are increasingly constrained by limited signal range and rising latency. As a result, valuable memory resources in large GPU clusters may be underutilized.
Designers of real-time control applications are increasingly finding it difficult to balance performance and peripheral integration without increasing system cost and complexity. To address these challenges, Microchip Technology Inc. has introduced the dsPIC33CK Value Line Digital Signal Controllers (DSCs), which provide essential real-time control at a competitive price.
Chips made with silicon carbide (SiC) are essential for improving the efficiency of electric cars and increasing their range. Bosch has unveiled its third generation of SiC chips, which are already being supplied as samples to automakers worldwide.
Melexis announces the MLX81119, an 18-channel RGB LIN LED controller with an integrated DC/DC converter, designed to simplify and optimize automotive lighting systems. By generating the LED supply voltage locally on the chip, the MLX81119 reduces power dissipation, external components, and space requirements
ROHM has developed a configurable power supply solution that combines the BD968xxC series PMIC with the BD96340MFFC DrMOS targeting automotive SoCs used in applications such as ADAS (Advanced Driver Assistance Systems), DMS (Driver Monitoring Systems) and sensor cameras.
Toshiba Electronics Europe GmbH (“Toshiba”) expands its TC75W series of dual CMOS comparators for overcurrent detection in industrial equipment with the introduction of the TC75W71FU. Featuring high-speed response times and a full input/output range, the product enables immediate shutdown to improve operational safety and supports low-voltage operation.
ROHM has developed a wireless power chipset consisting of the receiver - ML7670 - and the transmitter - ML7671, compatible with NFC (Near Field Communication) technology for compact connected personal devices, such as smart rings and bracelets, as well as peripheral devices, such as smart pens.
Siemens Digital Industries Software has announced Tessent Silicon Executable, a standalone application designed to translate and execute semiconductor test patterns over high-speed interfaces and protocols. The new software expands the capabilities of the Tessent ecosystem,...
eInfochips, an Arrow Electronics company specializing in semiconductor engineering services and products, has announced the completion of a demonstration of its capabilities for the comprehensive development of application-specific integrated circuits (ASICs).
Silicon Labs has unveiled several tools designed to incorporate artificial intelligence and new collaboration workflows into the development of IoT devices. The announcements, made during the seventh edition of the Works With Summit, include the public beta of the Simplicity AI SDK, a new...
MIPS and Xcelsa Labs have announced a non-exclusive strategic alliance to incorporate Xcelsa's Apex Design Optimization platform into the ecosystem of technologies used by MIPS for the development of custom chips. The collaboration aims to apply optimization capabilities and...
Nuvoton Technology Corporation Japan will begin supplying samples of the KA85010UA in January 2027, a sixth-generation battery monitoring integrated circuit capable of managing up to 26 cells and incorporating measurements using electrochemical impedance spectroscopy (EIS).
Toshiba Electronics Europe has expanded its range of industrial digital isolators with the DCL32xx00 series, consisting of four dual-channel devices that achieve transmission speeds of up to 25 Mbps. The new components feature a typical operating current consumption of...
Microchip Technology has expanded its 10BASE-T1S device family with the PMD LAN8679 and LAN8680 transceivers and the LAN8660X/1X/2X endpoint family with integrated transceiver.
The new components are intended to implement Single Pair Ethernet (SPE) architectures...
The rapid adoption of 48V power architectures in automotive, AI/data centers, networks, and industrial systems to improve efficiency and support higher power levels means that designers need more than just visualizing instantaneous voltage and current conditions.
Renesas Electronics has introduced the SLG46801, a new configurable mixed-signal device in the GreenPAK family designed for applications requiring reduced space for electronic components. The circuit is available in WLCSP and STQFN packages and incorporates non-digital memory...
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